发明名称 |
Anode for electroplating and method for electroplating using anode |
摘要 |
Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate. |
申请公布号 |
US9556534(B2) |
申请公布日期 |
2017.01.31 |
申请号 |
US201214344675 |
申请日期 |
2012.08.13 |
申请人 |
THE DOSHISHA |
发明人 |
Morimitsu Masatsugu |
分类号 |
C25D5/00;C25D3/56;C25D3/12;C25D3/04;C25D3/38;C25D3/34;C25D3/30;C25D3/22;C25D17/10;C25D11/02 |
主分类号 |
C25D5/00 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A method for electroplating which comprises electroplating a desired metal present in an aqueous electrolytic solution onto a cathode with an anode comprising a conductive substrate and a catalytic layer formed on the conductive substrate, and the catalytic layer is composed of amorphous ruthenium oxide and amorphous tantalum oxide and does not contain IrO2. |
地址 |
Kyoto JP |