| 发明名称 | Package with solder regions aligned to recesses | ||
| 摘要 | A method includes forming a passivation layer over a portion of a metal pad, forming a polymer layer over the passivation layer, and exposing the polymer layer using a photolithography mask. The photolithography mask has an opaque portion, a transparent portion, and a partial transparent portion. The exposed polymer layer is developed to form an opening, wherein the metal pad is exposed through the opening. A Post-Passivation Interconnect (PPI) is formed over the polymer layer, wherein the PPI includes a portion extending into the opening to connect to the metal pad. | ||
| 申请公布号 | US9559044(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201313926981 | 申请日期 | 2013.06.25 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yang Ching-Jung;Chen Hsien-Wei;Tu Hsien-Ming;Huang Chang-Pin;Lai Yu-Chia;Shao Tung-Liang |
| 分类号 | H01L21/768;H01L23/498;H01L23/31;H01L23/00;H01L23/522 | 主分类号 | H01L21/768 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A method comprising: forming a passivation layer over a portion of a metal pad; forming a polymer layer over the passivation layer; exposing the polymer layer using a photolithography mask, wherein the photolithography mask comprises an opaque portion, a transparent portion, and a partial transparent portion; developing the polymer layer to form an opening, wherein the metal pad is exposed through the opening; and forming a Post-Passivation Interconnect (PPI) over the polymer layer, wherein the PPI comprises a portion extending into the opening to connect to the metal pad. | ||
| 地址 | Hsin-Chu TW | ||