Cooling device for cooling a laser arrangement and laser system comprising cooling devices

摘要

The invention describes a cooling device (100) for cooling a laser arrangement and a laser system comprising at least two of such cooling devices (100). The invention further describes a method of manufacturing the cooling device (100) and the laser system. The cooling device (100) comprises a mounting area for the laser arrangement, a cooling volume (140) comprising cooling channels being arranged to cool the mounting area (105), a coolant inlet and a coolant outlet (150,145) being connected to the cooling channels of the cooling volume (140), a first coolant supply through hole (110) being connected to the coolant inlet (150), a second coolant supply through hole (111) being connected to the coolant outlet (145). The cooling device (100) further comprises at least one coupling element (115, 130, 135) enabling a detachable interconnection to a second cooling device (100) such that upon interconnecting the cooling device (100) to the second cooling device (100), the first coolant supply through hole (110) of the cooling device (100) being connected to a first coolant supply through hole of the second cooling device (100) and the second coolant supply through hole (111) of the cooling device (100) being connected to a second coolant supply through hole of the second cooling device (100), wherein the cooling device (100) being arranged in a way that a coolant can be supplied to the cooling volume via the first coolant supply through hole (110) and the second coolant supply through hole (111). The cooling device (100) enables a cost effective and scalable laser system.

主权项

1. A cooling device for cooling a laser arrangement, the cooling device being adapted to enable a detachable interconnection to a further cooling device, the cooling device comprising,
a mounting area for the laser arrangement; a cooling volume comprising cooling channels being-arranged to cool the mounting area; a coolant inlet and a coolant outlet connected to the cooling channels of the cooling volume, a first coolant supply through hole connected to the coolant inlet; a second coolant supply through hole connected to the coolant outlet; at least one coupling element enabling the detachable interconnection to the further cooling device such that upon interconnecting the cooling device to the further cooling device, the first coolant supply through hole of the cooling device is connected to a first coolant supply through hole of the further cooling device and the second coolant supply through hole of the cooling device is connected to a second coolant supply through hole of the further cooling device, wherein a coolant can be supplied to the cooling volume via the first coolant supply through hole and the second coolant supply through hole; and at least one recessed area, adjacent the mounting area for the laser arrangement, for mounting a Printed Circuit Board or a Direct Bonded Copper multilayer comprising at least a part of driving electronics for electrically driving the laser arrangement, each of the at least one recessed area defining at least one electrical supply through hole, for enabling electrical lines to pass through the cooling device and connect to the Printed Circuit Board or the Direct Bonded Copper multilayer, wherein the Printed Circuit Board or the Direct Bonded Copper multilayer comprises electrical connectors for enabling an electrical connection of the Printed Circuit Board or the Direct Bonded Copper multilayer of the cooling device to a further Printed Circuit Board or Direct Bonded Copper multilayer of the further cooling device upon the detachable interconnection between the cooling device and the further cooling device.