| 发明名称 | Warpage control in package-on-package structures | ||
| 摘要 | A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate. | ||
| 申请公布号 | US9559064(B2) | 申请公布日期 | 2017.01.31 |
| 申请号 | US201314096456 | 申请日期 | 2013.12.04 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chen Wei-Yu;Hu Yu-Hsiang (James);Lin Wei-Hung;Cheng Ming-Da;Liu Chung-Shi |
| 分类号 | H01L23/34;H01L23/00;H01L23/31 | 主分类号 | H01L23/34 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A package comprising: a bottom package comprising: a package substrate; anda device die over and bonded to the package substrate; a metal-particle-containing compound material over a top surface of the device die; a rigid plate over and contacting the metal-particle-containing compound material; a molding compound over the package substrate, wherein an entirety of the molding compound is lower than a top surface of the device die; and a top package bonded to the bottom package through solder regions penetrating through the molding compound. | ||
| 地址 | Hsin-Chu TW | ||