发明名称 |
PLATING PROCESSING METHOD OF GRIPPING SURFACE OF GRIPPING TOOL, AND GRIPPING TOOL |
摘要 |
A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved. |
申请公布号 |
SG10201600676U(A) |
申请公布日期 |
2017.01.27 |
申请号 |
SG10201600676U |
申请日期 |
2016.01.28 |
申请人 |
JUST CO., LTD. |
发明人 |
TAKASHI KONNO |
分类号 |
C25D15/00;A61B17/06;A61B17/30;C23C18/52;C25D7/00 |
主分类号 |
C25D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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