发明名称 |
COMPOSITION AND PROCESS FOR STRIPPING PHOTORESIST FROM A SURFACE INCLUDING TITANIUM NITRIDE |
摘要 |
A method and low pH compositions for removing bulk and/or hardened photoresist material from microelectronic devices have been developed. The low pH compositions include sulfuric acid and at least one phosphorus-containing acid. The low pH compositions effectively remove the hardened photoresist material while not damaging the underlying silicon-containing layer(s) or the metal gate materials. |
申请公布号 |
SG10201610541U(A) |
申请公布日期 |
2017.01.27 |
申请号 |
SG10201610541U |
申请日期 |
2013.05.17 |
申请人 |
ENTEGRIS, INC. |
发明人 |
COOPER, EMANUEL I.;CONNER, MARC;OWENS, MICHAEL |
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