METHOD AND SYSTEMS FOR COUPLING SEMICONDUCTOR SUBSTRATES

摘要

Systems and methods may be provided for coupling together semiconductor devices. One or more of the semiconductor devices may be provided with an array of bump contacts formed in an etch back process. The bump contacts may be indium bumps. The indium bumps may be formed by depositing a sheet of indium onto a surface of a device substrate, depositing and patterning a layer of photoresist over the indium layer, and selectively etching the indium layer to the surface of the substrate using the patterned photoresist layer to form the indium bumps. The substrate may be an infrared detector substrate. The infrared detector substrate may be coupled to a readout integrated circuit substrate using the bumps.

主权项

1. A method, comprising:
providing a substrate having a plurality of contacts on a surface of the substrate; forming a layer of conductive material on the surface; depositing and patterning a layer of photoresist over the layer of conductive material so that portions of the layer of photoresist remain on corresponding portions of the conductive material that are on the contacts; and etching uncovered portions of the layer of conductive material so that remaining portions of the layer of conductive material form conductive bumps on the contacts.