LED MOUNTING SUBSTRATE

摘要

Provided is an LED mounting substrate which improves the degree of freedom of arrangement. An LED mounting substrate 2 is provided with: an insulating layer 4 which is formed from a low-elasticity resin, and on the upper surface of which an LED element is to be mounted; and wiring conductors (7a, 7b) which are arranged within the insulating layer 4 in such a manner that the upper ends thereof are exposed from an upper surface 4a of the insulating layer 4 and the lower ends thereof are exposed from a lower surface 4b of the insulating layer 4, and which are electrically connected to the LED element. In this case, since the insulating layer 4 is formed from a low-elasticity resin, the flexibility of the LED mounting substrate 2 is able to be increased in comparison to the cases where the insulating layer 4 is formed from a glass epoxy resin or a ceramic.