MEMS COMPONENT INCLUDING A SOUND-PRESSURE-SENSITIVE DIAPHRAGM ELEMENT AND PIEZOSENSITIVE SIGNAL DETECTION

摘要

For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

主权项

1. A MEMS component, comprising:
a layer structure in which at least one sound-pressure-sensitive diaphragm element is formed, the diaphragm element spanning an opening or cavity in the layer structure, the diaphragm element being structured; at least one piezosensitive circuit element situated in an area of an attachment of the diaphragm element to the layer structure, deflections of the diaphragm element being detected with the aid of the piezosensitive circuit element; wherein the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and in the event of sound action, is deformed more strongly than adjoining sections of the diaphragm.