发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 According to one embodiment, a semiconductor memory device includes a substrate; a stacked body including a plurality of electrode layers; a select gate; a first insulating film; and a semiconductor film provided in the stacked body and in the substrate. The select gate includes a first portion provided on the substrate and spreading on a first plane crossing a stacking direction of the stacked body, and a second portion provided in the substrate and provided integrally with the first portion. The first insulating film is provided between the select gate and the substrate.
申请公布号 US2017025435(A1) 申请公布日期 2017.01.26
申请号 US201615017874 申请日期 2016.02.08
申请人 Kabushiki Kaisha Toshiba 发明人 SATO Mitsuru
分类号 H01L27/115;H01L21/28;H01L29/10 主分类号 H01L27/115
代理机构 代理人
主权项 1. A semiconductor memory device comprising: a substrate; a stacked body provided on the substrate and including a plurality of electrode layers separately stacked each other; a select gate provided between the substrate and the stacked body, the select gate including a first portion provided on the substrate and spreading on a first plane crossing a stacking direction of the stacked body, anda second portion provided in the substrate and provided integrally with the first portion; a first insulating film provided between the select gate and the substrate; and a semiconductor film provided in the stacked body and in the substrate, the semiconductor film extending in the stacking direction.
地址 Minato-ku JP