发明名称 |
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
According to one embodiment, a semiconductor memory device includes a substrate; a stacked body including a plurality of electrode layers; a select gate; a first insulating film; and a semiconductor film provided in the stacked body and in the substrate. The select gate includes a first portion provided on the substrate and spreading on a first plane crossing a stacking direction of the stacked body, and a second portion provided in the substrate and provided integrally with the first portion. The first insulating film is provided between the select gate and the substrate. |
申请公布号 |
US2017025435(A1) |
申请公布日期 |
2017.01.26 |
申请号 |
US201615017874 |
申请日期 |
2016.02.08 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
SATO Mitsuru |
分类号 |
H01L27/115;H01L21/28;H01L29/10 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor memory device comprising:
a substrate; a stacked body provided on the substrate and including a plurality of electrode layers separately stacked each other; a select gate provided between the substrate and the stacked body, the select gate including
a first portion provided on the substrate and spreading on a first plane crossing a stacking direction of the stacked body, anda second portion provided in the substrate and provided integrally with the first portion; a first insulating film provided between the select gate and the substrate; and a semiconductor film provided in the stacked body and in the substrate, the semiconductor film extending in the stacking direction. |
地址 |
Minato-ku JP |