SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

Provided are a semiconductor chip and a semiconductor package capable of obtaining stability and reliability through a connection structure using a through-silicon-via (TSV). The semiconductor chip includes a semiconductor substrate and a through-silicon-via (TSV) structure penetrating through the semiconductor substrate. A connection pad includes a foundation base disposed on a lower surface of the semiconductor substrate and connected to the TSV structure. A protruding portion protrudes from the foundation base and extend to an inside of a first groove formed in a lower surface of the semiconductor substrate.

主权项

1. A semiconductor chip comprising:
a semiconductor substrate; a through-silicon-via (TSV) structure penetrating the semiconductor substrate; and a connection pad comprising a foundation base disposed on a lower surface of the semiconductor substrate and connected to the TSV structure, and a protruding portion which protrudes from the foundation base and extends to an inside of a first groove formed in a lower surface of the semiconductor substrate.