SELF-DESTRUCTING CHIP

摘要

Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

主权项

1. A self-destructing chip comprising:
a first die including an electronic circuit; a second die composed of one or more polymers that disintegrate at a first temperature, the second die defining a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner, wherein a second subset of the chambers contain an etchant to etch materials of the first die, wherein in response to a trigger event, the electronic circuit is configured to:
expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature; andrelease the etchant from the second subset of the chambers to etch the first die.