MULTI-LAYER SUBSTRATE WITH AN EMBEDDED DIE

摘要

The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.

主权项

1. An apparatus comprising:
a core layer having a cavity; a die mounted within the cavity by a mounting material, wherein the die includes a die body, a first die conductive element on a top surface of the die body, and a dielectric layer over the first die conductive element; and a first substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the first die conductive element, wherein overlapping portions of the first die conductive element and the first substrate conductive element are separated by the dielectric layer and form an electronic component.