发明名称 |
CAPACITOR STRUCTURES AND METHODS OF FORMING THE SAME, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME |
摘要 |
A capacitor structure includes a plurality of lower electrodes, a support pattern structure, a dielectric layer, and an upper electrode. The lower electrodes are formed on a substrate. The support pattern structure is formed between the lower electrodes, and includes a lower support pattern and an upper support pattern structure over the lower support pattern. The upper support pattern structure includes a plurality of upper support patterns spaced apart from each other in a direction substantially perpendicular to a top surface of the substrate. The dielectric layer is formed on the lower electrodes and the support pattern structure. The upper electrode is formed on the dielectric layer. A sum of thicknesses of the plurality of upper support patterns in the direction substantially perpendicular to the top surface of the substrate is about 35% to about 85% of a total thickness of the upper support pattern structure. |
申请公布号 |
US2017025416(A1) |
申请公布日期 |
2017.01.26 |
申请号 |
US201615067705 |
申请日期 |
2016.03.11 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Han Jung-Hoon;Lee Jong-Min;Kim Dong-Wan;Lee Ju-Ik |
分类号 |
H01L27/108;H01L29/423;H01L49/02 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
1. A capacitor structure, comprising:
a plurality of lower electrodes on a substrate; a support pattern structure between the lower electrodes, the support pattern structure including:
a lower support pattern; andan upper support pattern structure over the lower support pattern, the upper support pattern structure including a plurality of upper support patterns spaced apart from each other in a direction substantially perpendicular to a top surface of the substrate; a dielectric layer on the lower electrodes and the support pattern structure; and an upper electrode on the dielectric layer, wherein a sum of thicknesses of the plurality of upper support patterns in the direction substantially perpendicular to the top surface of the substrate is about 35% to about 85% of a total thickness of the upper support pattern structure. |
地址 |
Suwon-si KR |