Package-On-Package (PoP) Structure Including Stud Bulbs and Method

摘要

Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.

主权项

1. A device comprising:
a first pad on a first substrate; a stud bulb on the first pad; an elongated tail extending from the stud bulb; a second pad on a second substrate; and a solder connector on the second pad, the solder connector electrically coupled to the stud bulb, a height of the solder connector being less than a distance between the first pad and the second pad.