METHOD OF BONDING A BUMP OF A SEMICONDUCTOR PACKAGE AND APPARATUS FOR PERFORMING THE SAME

摘要

In a method of bonding a bump of a bump of a semiconductor package, a semiconductor chip including the bump and a non-conductive film (NCF) may be on standby over a package substrate on a bonding stage. The semiconductor chip may be cooled. The semiconductor chip may be positioned on the package substrate. The semiconductor chip may be heated to a bonding temperature to bond the bump to the package substrate. Thus, the NCF of the semiconductor chip, which may be on standby at the buffer, may not be melt.

主权项

1. A method of bonding a bump of a semiconductor package, the method comprising:
placing a semiconductor chip over a package substrate on a bonding stage, a semiconductor chip including the bump and a non-conductive film (NCF); cooling the semiconductor chip; placing the semiconductor chip on the package substrate; and heating the semiconductor chip to a bonding temperature to bond the bump to the package substrate.