Method for Positioning a Semiconductor Chip on a Carrier and Method for Material-Fit Bonding of a Semiconductor Chip to a Carrier

摘要

A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The semiconductor chip is positioned on the carrier by picking the semiconductor chip and placing the semiconductor chip on the carrier, and pressing the semiconductor chip onto the carrier by a pressing force in a pressing direction, such that the pressing force acts on the semiconductor chip only above one or more continuous chip metallization sections arranged on the top side. Each of the one or more continuous chip metallization sections includes an annularly closed edge section which has a minimum width of more than zero in each direction perpendicular to the pressing direction. The pressing force does not act on the semiconductor chip above any of the edge sections.

主权项

1. A method for positioning a semiconductor chip on a carrier, the semiconductor chip comprising a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side, the method comprising:
picking the semiconductor chip and placing the semiconductor chip on the carrier; and pressing the semiconductor chip onto the carrier by a pressing force in a pressing direction, such that the pressing force acts on the semiconductor chip only above one or more continuous chip metallization sections arranged on the top side, each of the one or more continuous chip metallization sections comprising an annularly closed edge section which has a minimum width of more than zero in each direction perpendicular to the pressing direction, and the pressing force not acting on the semiconductor chip above any of the edge sections.