METHOD FOR DETERMINING A BONDING CONNECTION IN A COMPONENT ARRANGEMENT AND TEST APPARATUS

摘要

The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).

主权项

1. A Method for determining a bonding connection in a component arrangement, wherein the method comprises the following steps:
producing a bonding connection between a bonding section of a bonding wire and a metal contact point, structuring a top-side surface of the bonding wire in the region of the bonding section, and determining the bonding connection, wherein in this
a test voltage is applied to the bonding wire and the bonding connection, so that the bonding connection heats up owing to the current flow,generating a thermogram for the heated bonding connection anddetermining whether the bonding connection has been produced correctly by evaluating the thermogram.