SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE

摘要

The present technology relates to a semiconductor apparatus which makes it possible to provide an image sensor package capable of handling an increase in the number of I/O's in an image sensor, a method for manufacturing the same, and an electronic device. The semiconductor apparatus is provided with: an image sensor including a photoelectric conversion element formed on a semiconductor substrate; a glass substrate disposed on a first principal surface side of the image sensor; a wiring layer formed on a second principal surface side on the opposite side from the first principal surface of the image sensor; and an external terminal for the output of a signal from the image sensor to the outside. A metal wiring in the wiring layer is formed so as to extend from the inside of the image sensor toward the outer periphery and connected to the external terminal. The present technology can be applied in an image sensor package and the like, for example.