| 摘要 |
The present invention relates to an electronic apparatus, the back plate, the I/O module, the power supply, the node module and the like are reasonably and neatly laid out in the case, so that more modules can be laid out in a limited case space, thus having a high utilization rate and a low cost. Besides, the I/O module, the power supply module and the node module are separately designed, and the modules cooperate with each other; the modules are snap structures, and can be assembled and disassembled by hand, which increases operation and maintenance efficiency. Moreover, the completion of the signal transmission among different modules mainly depends on the golden finger or the high-speed back plate connector, thus the case is clean and neat inside. |
| 主权项 |
1. An electronic apparatus, comprising:
a case, which comprises two sidewalls and a bottom plate connecting the two sidewalls, the case has a first end along a direction of the sidewalls and a second end opposite the first end, the case has a first receiving space adjacent to the first end, and the case has a second receiving space adjacent to the second end; a back plate, which is disposed, perpendicular to the two sidewalls, between the first receiving space and the second receiving space, has a first insertion and extraction portion towards the first receiving space and a second insertion and extraction portion towards the second receiving space; an I/O module, which is received in the first receiving space, has an I/O module assembling portion, and is pluggably electrically connected to the first insertion and extraction portion of the back plate; a power supply module, which is received in the first receiving space, has a power supply module assembling portion, and is pluggably electrically connected to the first insertion and extraction portion of the back plate, used to supply power of the electronic apparatus; a node module, which is disposed in the second receiving space, has a node module assembling portion, and is pluggably electrically connected to the second insertion and extraction portion of the back plate, and communicated with a corresponding I/O module through the back plate; the second receiving space is divided into multiple front-end regions, and each of the front-end regions is provided with at least one node module, the first receiving space is divided into multiple rear-end regions having the same height and arranged side by side, and each of the rear-end regions is used to receive at least one I/O module or at least one power supply module. |
