WAFER PROCESSING APPARATUS HAVING GAS INJECTOR

摘要

A wafer processing apparatus may include a reaction tube extending in a vertical direction and defining a process chamber for receiving a boat that holds a plurality of wafers. A gas injector may be configured to supply a reaction gas into the process chamber and may include a gas distributor extending in the vertical direction in the reaction tube. The gas injector may have a plurality of ejection holes for spraying the reaction gas. An inner diameter of the gas distributor may be at least 10 mm, and a sectional area ratio of the total sectional area of the ejection holes to a sectional area of the gas distributor is about 0.3 or less.

主权项

1. A wafer processing apparatus, comprising:
a reaction tube extending in a vertical direction and defining a process chamber for receiving a boat that holds a plurality of wafers; and a gas injector configured to supply a reaction gas into the process chamber, the gas injector comprising a gas distributor extending in the vertical direction in the reaction tube, the gas distributor having a plurality of ejection holes for spraying the reaction gas, wherein an inner diameter of the gas distributor is at least 10 mm, and a sectional area ratio of the total sectional area of the ejection holes to a sectional area of the gas distributor is about 0.3 or less.