发明名称 MEMORY CELL, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 A memory cell (1) according to the present invention is provided with: a memory gate structure (2) formed by laminating, in the stated order, a lower memory gate insulation film (10), a charge accumulation layer (EC), an upper memory gate insulation film (11), and a metal memory gate electrode (MG); a first selection gate structure (3) having a metal first selection gate electrode (DG) along a side wall spacer (8a) provided to a side wall of the memory gate structure (2); and a second selection gate structure (4) having a metal second selection gate electrode (SG) along another side wall spacer (8b) provided to a side wall of the memory gate structure (2). It is thereby possible to form the metal memory gate electrode (MG), the metal first selection gate electrode (DG), and the metal second selection gate electrode (SG) from the same metal material as a metal logic gate electrode (LG1), making it possible to form the metal memory gate electrode (MG), the metal first selection gate electrode (DG), and the metal second selection gate electrode (SG) in a series of manufacturing steps for forming the metal logic gate electrode (LG1) comprising a metal material on a semiconductor substrate.
申请公布号 WO2017014254(A1) 申请公布日期 2017.01.26
申请号 WO2016JP71351 申请日期 2016.07.21
申请人 FLOADIA CORPORATION 发明人 YOSHIDA Shoji;OWADA Fukuo;OKADA Daisuke;KAWASHIMA Yasuhiko;YOSHIDA Shinji;YANAGISAWA Kazumasa;TANIGUCHI Yasuhiro
分类号 H01L21/336;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/336
代理机构 代理人
主权项
地址