LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE

摘要

This light emitting device (100) is provided with: a light emitting element (101) which comprises a growth substrate (102) and a semiconductor layer (103) positioned below the growth substrate (102); a light transmitting member (107) arranged on the upper surface of the light emitting element (101); and a transparent resin (108) which bonds the upper surface of the light emitting element (101) and the lower surface of the light transmitting member (107) with each other. The lower surface of the light transmitting member (107) internally comprises the upper surface of the light emitting element (101); and the transparent resin (108) continuously covers the lower surface of the light transmitting member (107) and the lateral surface of the semiconductor layer (103). When the lateral surface of the light emitting element (101) is viewed, the transparent resin (108) is formed so as to cover a covered part (130) of the semiconductor layer (103), said covered part being positioned in the central part in the direction parallel to the upper surface of the light emitting element (101) and so as to expose an exposed portion (120) of the semiconductor layer (103), said exposed portion being positioned on a side edge in the direction parallel to the upper surface of the light emitting element (101), and covers the lateral surface of the semiconductor layer (103) in 20% or more of the length of the semiconductor layer (103) in the above-described direction.