WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE

摘要

A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

主权项

1. A method of forming a circuit board comprising:
forming a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands; wherein the component pattern includes co-axial strands having a dielectric material between a solid conductor material wire and an outer shield cylinder of conductor material surrounding the solid conductor material wire.