SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

摘要

In accordance with an embodiment, a semiconductor component includes a support having a side in which a device receiving structure and an interconnect structure are formed and a side from which a plurality of leads extends. A semiconductor device having a control terminal and first and second current carrying terminals and configured from a III-N semiconductor material is mounted to the device receiving structure. The control terminal of the first electrical interconnect is coupled to a first lead by a first electrical interconnect. A second electrical interconnect is coupled between the first current carrying terminal of the semiconductor device and a second lead. The second current carrying terminal of the first semiconductor device is coupled to the device receiving structure or to the interconnect structure.

主权项

1. A semiconductor component having at least first and second terminals, comprising:
a support having first and second sides and a plurality of leads, the first side of the support having a first device receiving structure, a second device receiving structure, and a first interconnect structure and the second side of the support having a contact; a first semiconductor device mounted to the first device receiving structure, the first semiconductor device having a control terminal and first and second current carrying terminals and configured from a III-N semiconductor material; a first electrical interconnect coupled between the control terminal of the first semiconductor device and a first lead of the plurality of leads; a second electrical interconnect coupled between the first current carrying terminal of the first semiconductor device and the first interconnect structure; and a third electrical interconnect coupled between the second current carrying terminal of the first semiconductor device and the second device receiving structure.