发明名称 |
HEAT SPREADING STRUCTURE AND METHOD FOR FORMING THE SAME |
摘要 |
The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same. |
申请公布号 |
WO2017014736(A1) |
申请公布日期 |
2017.01.26 |
申请号 |
WO2015US41054 |
申请日期 |
2015.07.20 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
TIEN, Pei;WANG, Chao-Yuan;LIU, Ching-Yi |
分类号 |
H01L23/34;H01L23/36;H01L23/373 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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