| 摘要 |
The present invention relates to an apparatus and a method for processing a substrate such as a semiconductor wafer and, more specifically, to a separate process apparatus and method for processing a substrate in which a liquid treatment process such as an etching process and a cleaning process are separated and performed in different chambers. In order to achieve the technical objective, the separate process apparatus for processing a substrate, according to the present invention, comprises: a first chamber for performing a liquid treatment process of supplying a first treatment liquid to a substrate; a second chamber for performing a liquid treatment process of supplying a second treatment liquid to the substrate; and a transfer unit which transfers the substrate between the first and second chambers, wherein the processes performed in the first chamber and the second chamber are separated to inhibit crystallization in the chambers. |
