| 摘要 |
The invention relates to a device for adsorbing at least one component from a gas mixture by temperature swing adsorption, comprising a through-flow chamber (7) and a cooling chamber (8) for accommodating a heat transfer fluid, wherein the through-flow chamber (7) is separated from the cooling chamber (8), wherein the through-flow chamber (7) has an adsorbent (1) which contains a plurality of (two or more) adsorbent bodies containing a porous and adsorptively additive first material (3) and a second material (4) having better thermal conductivity as compared to the first material (3) and wherein the first material (3) is at least partly surrounded by the second material (4). |
