发明名称 INTEGRATED LIGHT-EMITTING PACKAGE
摘要 An integrated light-emitting package according to an embodiment comprises: a light-emitting element layer including a plurality of light-emitting units arranged at predetermined intervals; an optical conversion substrate disposed along the upper portion of the light-emitting device layer; and a first adhesive member disposed in each gap between the light-emitting units.
申请公布号 WO2017014574(A1) 申请公布日期 2017.01.26
申请号 WO2016KR07947 申请日期 2016.07.21
申请人 LG INNOTEK CO., LTD. 发明人 LEE, In Jae;KIM, Won Jin
分类号 H01L33/64 主分类号 H01L33/64
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