| 摘要 |
A method for manufacturing a stacked circuit board comprises: a cutting step: tailoring a substrate (1) according to a set shape and size; a printing step: printing an adhesive on the substrate (1) to form an insulation layer (2); a bonding step: bonding a conductive wire layer (3) manufactured in a mechanical manner to the insulation layer corresponding to the substrate, so as to form a bonding structure; and a lamination step: laminating the bonding structure to manufacture a circuit board. A stacked circuit board. The adhesive is printed on the substrate (1) as the insulation layer (2); and the conductive wire layer (3) is bonded and laminated on the insulation layer, the conductive wire layer being formed by stamping a metal sheet by means of a stamping die (4). In the method for manufacturing a stacked circuit board, the stamped conductive wire layer is bonded and laminated on a base material having strong adhesiveness and heat dissipation performance, so as to manufacture a circuit board, and accordingly the processing is convenient and the manufacturing efficiency is high, etching is not needed, and no chemical medicine is used, and the manufacturing method and the stacked circuit board are environmentally-friendlier; the manufacturing cost is reduced, and the stacked circuit board has good performance and high reliability. |
