SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

摘要

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for adjusting a wafer translator for testing semiconductor dies includes the semiconductor wafer translator having a wafer translator substrate with a wafer-side configured to face the dies. A plurality of wafer-side contact structures is carried by the wafer-side of the wafer translator. The apparatus also includes a shaping wafer having a shaping wafer substrate, and a plurality of cavities in the shaping wafer substrate. The wafer-side contact structures are shaped by contacting surfaces of the cavities of the shaping wafer substrate.

主权项

1. An apparatus for adjusting a wafer translator for testing semiconductor dies, comprising:
the semiconductor wafer translator comprising:
a wafer translator substrate having a wafer-side configured to face the dies, and an inquiry-side facing away from the wafer-side, anda plurality of wafer-side contact structures carried by the wafer-side of the wafer translator; and a shaping wafer comprising:
a shaping wafer substrate, anda plurality of cavities in the shaping wafer substrate, wherein individual cavities face individual wafer-side contact structures, and wherein the wafer-side contact structures are shaped by contacting surfaces of the cavities of the shaping wafer substrate.