| 发明名称 |
MEMS COMPONENT INCLUDING A SOUND-PRESSURE-SENSITIVE DIAPHRAGM ELEMENT |
| 摘要 |
A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element. |
| 申请公布号 |
US2017022046(A1) |
申请公布日期 |
2017.01.26 |
| 申请号 |
US201615212334 |
申请日期 |
2016.07.18 |
| 申请人 |
Robert Bosch GmbH |
发明人 |
BUCK Thomas;Purkl Fabian;Stumber Michael;Scheben Rolf;Stein Benedikt;Schelling Christoph |
| 分类号 |
B81B3/00;H04R3/00;H04R19/04 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A MEMS component, comprising:
a layer structure; at least one sound-pressure-sensitive diaphragm element formed in the layer structure, the diaphragm element spanning an opening in the layer structure and being attached to the layer structure of the component via at least one column element in a central area of the opening; at least one piezosensitive circuit element to detect deflections of the diaphragm element, the piezosensitive element implemented in the layer structure of the diaphragm element and being situated in an area of the attachment of the diaphragm element to the column element. |
| 地址 |
Stuttgart DE |
