SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

In order to improve the reliability of a semiconductor device, the present invention embodies a basic concept in which a semiconductor chip (CHP1) mounted on an Ag layer (AGL) is fixed by means of a temporary fixing material (TA) with tacking properties in such a way as to minimize the formation of the temporary fixing material (TA) on the surface of the Ag layer (AGL), which is in a porous state. Specifically, the temporary fixing material (TA) is supplied in such a way that a portion thereof is in contact with a chip mount portion (TAB), while the semiconductor chip (CHP1) is mounted on the Ag layer (AGL) in such a way that a part of the back surface of the semiconductor chip (CHP1) is in contact with the temporary fixing material (TA).