发明名称 |
OPTOELECTRONIC SEMICONDUCTOR COMPONENT |
摘要 |
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body. |
申请公布号 |
US2017025581(A1) |
申请公布日期 |
2017.01.26 |
申请号 |
US201615288176 |
申请日期 |
2016.10.07 |
申请人 |
OSRAM Opto Semiconductor GmbH |
发明人 |
Weidner Karl;Wirth Ralph;Kaltenbacher Axel;Wegleiter Walter;Barchmann Bernd;Wutz Oliver;Marfeld Jan |
分类号 |
H01L33/48;H01L31/0203;H01L31/0232;H01L33/50;H01L33/62;H01L31/02;H01L25/04;H01L25/075;H01L33/60 |
主分类号 |
H01L33/48 |
代理机构 |
|
代理人 |
|
主权项 |
1. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via comprising an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via comprises a contact pin, said contact pin comprising an electrically conductive material; and said contact pin is laterally completely enclosed by the shaped body. |
地址 |
Regensburg DE |