SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

Reliability is improved while curbing manufacturing cost. A semiconductor device (100) includes a substrate (110), an insulating substrate (141 and 142) mounted on the substrate (110), a metal pattern (152 and 155) formed on the insulating substrate (141 and 142), an electronic part mounted on the metal pattern (152 and 155) across a bond, and a wire member (201 to 206), separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern (152 and 155) and around the electronic part.