| 摘要 |
This vacuum processing apparatus has: a vacuum container, which has an air releasing unit connected thereto, and which can be depressurized; a substrate holder that is provided with a substrate placing surface for placing a substrate that is disposed in the vacuum container; and a gas introduction unit that is provided with a gas introduction port for introducing a reactive gas into the vacuum container. The gas introduction port is disposed at a position where molecules of the reactive gas discharged into the vacuum container from the gas introduction port are blocked from linearly reaching the substrate placing surface from the gas introduction port, said position being substantially on the center axis of the substrate placing surface, and the reactive gas reaches the substrate placing surface by means of diffusion of a molecular flow. |
