发明名称 電子部品及びその製造方法
摘要 An electronic component includes a first magnetic substrate provided with a first notch portion and a second notch portion, a multilayer body, a coil which includes a coil portion, a first lead portion, and a second lead portion. The first lead portion and the second lead portion are connected to the two end portions of the coil portion and overlap the first notch portion and the second notch portion, respectively. The electronic component further includes a first outer electrode and a second outer electrode, a first connection portion and a second connection portion which connect the outer electrodes to the lead portions. Particles are disposed at joint portions of the lead portions and the connection portions and have a coefficient of linear expansion smaller than the coefficients of linear expansion of the first lead portion, the second lead portion, the first connection portion, and the second connection portion.
申请公布号 JP6064854(B2) 申请公布日期 2017.01.25
申请号 JP20130203402 申请日期 2013.09.30
申请人 株式会社村田製作所 发明人 北島 正樹
分类号 H01F27/29;H01F17/00;H01F41/04 主分类号 H01F27/29
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