| 摘要 |
PROBLEM TO BE SOLVED: To prevent the bending deformation of a semiconductor chip due to the local breakage of an adhesive, even in a state where a diaphragm peripheral region is pressed by a metal mold.SOLUTION: In a lead frame 1, a groove part 18 is formed across the outside of one side surface 3c from an inner surface of a first semiconductor chip 3. If a pressing force is applied to a first adhesive 5 via the first semiconductor chip 3 by a partition protrusion 11a of an insert piece 11, the first adhesive 5 having a low Young's modulus and a high fluidity flows to the groove part 18 formed on the lead frame 1 and thereby, a local breakage does not occur in a peripheral region of a diaphragm 30. Thus, in the first semiconductor chip 3, a bending deformation does not occur, and strain and cracks do not occur. |
