BONDING A DIE, IN PARTICULAR SEQUENTIAL BONDING A PLURALITY OF DIE, TO A CIRCUIT BOARD OR A LEAD FRAME WITH FORMATION OF A HIGH MELTING ALLOY LAYER AND CORRESPONDING DEVICE

摘要

A method of bonding a plurality of die (10, 22) having first and second metal layers (m1, m2, m5, m6) on a die surface to a board (16) comprises placing a first die (10) onto a board (16) comprising one of a ceramic or substrate board or metal lead frame having a solderable surface (18) and placing the first die (10) and the board (16) into a reflow oven. The method then includes reflowing at a first reflow temperature for a first period until the first metal board layer (18) and at least one of the first and second metal die layers (m1, m2) of the first die (10) form an alloy (m4) to adhere the first die (10) to the board (16). The alloy (m4) has a melting temperature higher than the first reflow temperature. Accordingly, additional die (22) may be added at a later time and reflowed to attach to the board (16) without causing the bonding of the first die (10) to the board (16) to fail.