发明名称 Process FOR THIN FILM DEPOSITION
摘要 A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed.
申请公布号 EP2102383(B1) 申请公布日期 2017.01.25
申请号 EP20070868038 申请日期 2007.12.26
申请人 Eastman Kodak Company 发明人 NELSON, Shelby Forrester;LEVY, David Howard;KERR, Roger Stanley
分类号 C23C16/455;C23C16/44;C23C16/54 主分类号 C23C16/455
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