Semiconductor composite LED apparatus

摘要

A semiconductor composite apparatus includes a substrate (2) and a planarizing layer (3), and a semiconductor thin film (4). The planarizing layer (3) is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate (2), and a second surface that is on the side of the planarizing layer (3) remote from the substrate (2). The semiconductor thin film (4) formed on the planarizing layer (3). The second surface has a roughness of not more than 5 nm.