发明名称 熱伝導性粘着樹脂組成物および熱伝導性粘着シート
摘要 This thermally conductive adhesive resin composition contains an acrylic polymer and a metal hydroxide. The weight average molecular weight in terms of standard polystyrene of the toluene-soluble fraction of an adhesive layer, which is formed from the thermally conductive adhesive resin composition, as determined by GPC using a differential refractometer detector is 250,000 or more but less than 400,000 in the high molecular weight region where the molecular weight in terms of polystyrene is 10,000 or more, while being 5,000 or less in the low molecular weight region where the molecular weight in terms of polystyrene is less than 10,000. The adhesive layer formed from the thermally conductive adhesive resin composition has a density of 1.2-1.7 g/cm3.
申请公布号 JP6067969(B2) 申请公布日期 2017.01.25
申请号 JP20110271396 申请日期 2011.12.12
申请人 日東電工株式会社 发明人 中山 純一;寺田 好夫;古田 憲司;東城 ;古田 喜久
分类号 C09J133/06;C09J7/02;C09J9/00;C09J11/04;C09J11/08;C09J133/14 主分类号 C09J133/06
代理机构 代理人
主权项
地址