| 摘要 |
PROBLEM TO BE SOLVED: To provide a correction apparatus capable of more efficiently correcting a wafer that may not be performed only by pressing.SOLUTION: The correction apparatus includes: an upper plate 910, disposed at a molded wafer or an upper part of a printed-circuit board, provided with a first heater; and a table, disposed at the wafer or a lower part of the printed-circuit board, provided with a second heater. By heating the upper part and the lower part of the wafer that is molded at a time of correction, since a temperature of the upper part of the wafer becomes higher than a temperature of the lower part of the wafer, the correction is more efficiently performed. |
