| 摘要 |
PROBLEM TO BE SOLVED: To provide polyimide for semiconductor adhesion that has excellent adhesive power to SiC, and that hardly warps due to shrinkage.SOLUTION: The polyimide for a semiconductor adhesion contains 10-40 mole% of a residue of diamine shown by formula (1) in the whole of a diamine residue. In the general formula (1), Rdenotes hydrogen, a 1-4C alkyl group, a 1-4C fluoroalkyl group, a 1-4C alkoxyl group, a phenyl group or an alkylation phenyl group in which at least one of a hydrogen atom of a phenyl group is substituted by a 1-10C alkyl group; Rand Reach independently denote a 1-4C alkyl group, a 1-4C fluoroalkyl group, a 1-4C alkoxyl group, a phenyl group or an alkylation phenyl group in which at least one hydrogen atom of a phenyl group is substituted by a 1-10C alkyl group; x and z each denote an integer of 0-10, and y denotes an integer of 1-50, and 0<x+z≤20. |
