| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method hardly having a trouble in a sensing part following the deformation of a film even when the film is sandwiched by a lower die and an upper die and put into a pressed state.SOLUTION: A support part 4c has one face 4ca and the other face 4cb opposite from the one face 4ca. A lead frame 4 formed with a recess part 4cc at a position corresponding to a sensing part 3e is prepared in the one face 4ca. The other end 3d side in the one face 3a of the sensor chip 3 is connected to the one face 4ca of the support part 4c so that the sensing part 3e and the recess part 4cc are overlapped with each other when viewed from the direction of a normal line for the one face 4ca of the support part 4c. A work is arranged on a die 9 so that the film 10 is put into a pressed state by being sandwiched by a lower die 9a and an upper die 9b. |
