BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY

摘要

There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 µm to 3 µm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at% to 15 at%.