发明名称 METHOD FOR FORMING ALUMINIDE COATING FILM ON BASE
摘要 There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere.
申请公布号 EP2966190(A4) 申请公布日期 2017.01.25
申请号 EP20130876879 申请日期 2013.03.07
申请人 Hitachi, Ltd. 发明人 NAKANO, Hiroshi;NEGISHI, Yoshinori;AKAHOSHI, Haruo;IZUMI, Takeshi;KOJIMA, Yoshitaka;ARIKAWA, Hideyuki
分类号 C23C10/28;C21D6/00;C22F1/10;C22F1/18;C23C10/04;C25D3/66;C25D5/02;C25D5/34;C25D5/50;C25D7/00;C25D17/02;C25D21/11;F01D5/28;F01D25/00;F02C7/00 主分类号 C23C10/28
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