发明名称 |
METHOD FOR FORMING ALUMINIDE COATING FILM ON BASE |
摘要 |
There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere. |
申请公布号 |
EP2966190(A4) |
申请公布日期 |
2017.01.25 |
申请号 |
EP20130876879 |
申请日期 |
2013.03.07 |
申请人 |
Hitachi, Ltd. |
发明人 |
NAKANO, Hiroshi;NEGISHI, Yoshinori;AKAHOSHI, Haruo;IZUMI, Takeshi;KOJIMA, Yoshitaka;ARIKAWA, Hideyuki |
分类号 |
C23C10/28;C21D6/00;C22F1/10;C22F1/18;C23C10/04;C25D3/66;C25D5/02;C25D5/34;C25D5/50;C25D7/00;C25D17/02;C25D21/11;F01D5/28;F01D25/00;F02C7/00 |
主分类号 |
C23C10/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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