发明名称 加工装置
摘要 PROBLEM TO BE SOLVED: To control processing pressure accurately with an inexpensive construction.SOLUTION: In a processing device which comprises: at least a holding table 11 for holding a plate-like workpiece; processing means 13 for grinding or polishing the plate-like workpiece held by the holding table 11; processing sending means 14 for moving the processing means 13 close to or away from the holding table 11; a base 15 for supporting the holding table 11; and a column 16 for standing from the base 15 and arranging the processing means 13, provided furthermore are a strain gauge 17 arranged at the column 16, a recognition part 18 for recognizing a strain amount measured by the strain gauge 17, and a control part 19 for controlling the processing sending means 14 related to the processing pressure by the processing means 13 corresponding to the strain amount recognized by the recognition part 18. Since a constant relationship applies for the relation between the strain amount of the column 16 and the processing pressure regardless of a rotation load, the processing pressure can be controlled accurately by recognizing the strain amount. Furthermore, the cost can be suppressed because of no need of providing plural pressure gauges.
申请公布号 JP6069074(B2) 申请公布日期 2017.01.25
申请号 JP20130077552 申请日期 2013.04.03
申请人 株式会社ディスコ 发明人 吉田 真司
分类号 B24B49/16;H01L21/304 主分类号 B24B49/16
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