发明名称 炭化珪素半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To inhibit fluctuation of electrical characteristics in a silicon carbide semiconductor device, which is caused from fluctuation in activation rate of an ion-implanted impurity.SOLUTION: A silicon carbide semiconductor device 10 comprises: a base region 3 which is formed by ion implanting an impurity into a drift layer 2 composed of a silicon carbide and has an impurity concentration distribution of a retro-grade profile. After performing a heat treatment for electrically activating the impurity ion implanted into the base region 3, a surface layer of a semiconductor layer, which is damaged by the heat treatment is removed. At this time, a thickness of the drift layer 2 to be removed is determined based on a calculation result of an activation rate of the impurity.
申请公布号 JP6066874(B2) 申请公布日期 2017.01.25
申请号 JP20130191276 申请日期 2013.09.17
申请人 三菱電機株式会社 发明人 古橋 壮之;岡部 博明;田中 貴規;渡辺 友勝;今泉 昌之
分类号 H01L21/336;H01L21/66;H01L29/12;H01L29/78 主分类号 H01L21/336
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