发明名称 半導体装置及びその製造方法
摘要 PROBLEM TO BE SOLVED: To improve high frequency characteristics by realizing lower capacitance, in other words, reduction in capacitance which is caused by an insulating film present at least either between a gate electrode and a source electrode or between a gate electrode and a drain electrode.SOLUTION: A semiconductor device includes a semiconductor region 1, a gate electrode 2 formed above the semiconductor region, a source electrode 3 and a drain electrode 4 which are formed above the semiconductor region, on each side across the gate electrode, a first insulating film 5 covering a surface of the semiconductor region, a second insulating film 6 which has a dielectricity lower than the first insulating film, and is provided above the first insulating film present at least either between the source electrode and the gate electrode or between the drain electrode and the gate electrode.
申请公布号 JP6065393(B2) 申请公布日期 2017.01.25
申请号 JP20120057483 申请日期 2012.03.14
申请人 富士通株式会社 发明人 倉橋 菜緒子
分类号 H01L21/338;H01L21/28;H01L29/778;H01L29/812 主分类号 H01L21/338
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